Rotary High Temp Test & Vision Sorting Handler
The ECA Hot Test Turret featuring;
- Improve process cycle time by linking test and MSP in one process.
- Eliminate mixed device by merging Test & MSP with automated flow.
- Reduce cost of test; one integrated handler cost less than single test handler & MSP Turret.
- Improve jam rate via innovative design.
Specification Highlight!
- Wide Package Range
- Up to 90% Tester utilization.
- Hot Turret Table equipped to deliver the unit to good/reject destination.
- Short Index Time (500ms)
- UPH : 10-14K
- High Flexibility Test Method: Single Test, 2x Test, 4x Test, 8 Test. Maximum up to 8x.
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Descriptions |
Specifications |
|
|
General Info |
Package |
SOICs,
SO Power, TO Power |
|
UPH
(Zero Test Time) |
12,000 |
|
|
Floor
Space |
1200
x 2500 x 1700 mm |
|
|
Weight,
kg |
Approx.
3000kg |
|
|
Hot Test |
Loader |
Tube
Stackle Loader |
|
Soaking
Temperature |
150°C –
300°C |
|
|
Total
Heating Unit |
400
unit per cycle |
|
|
Test
Capability |
1x up
to 8x with Individual Controllable Test Plunger |
|
|
Turret
Table |
4x
Index Point to Transfer Unit After Test |
|
|
Reject
Output |
Multi-tube
Reject Station by Pick & Place Arm |
|
|
Test-Mark-Scan-Pack |
Loader |
Cooling
Track Loader with 2x Buffer Track |
|
Orientator,
Precisor |
Auto/Easy
Conversion With Unit Present Sensor |
|
|
Test
Station |
Max. 5x
Station |
|
|
Marking
Table |
16x
Unit Nest for 2 Different Packages |
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|
Laser
Mark Unit |
10w –
30w Laser Mark Unit |
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|
Output |
Tube
Unloader, Tape & Reel |
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|
Reject |
Multi-tube
Reject station, Bucket |
|
|
Purge
Bin |
With
Safety Sensor |
|
|
Vision System |
Top
Vision |
Marking
Mold Compound, Chipping |
|
|
Bottom
Vision |
Heatsink,
Mold compound, Chipping |
|
|
3D Lead
Vision |
Lead
Length, Pitch, Deviation, Standoff |
|
|
In-Pocket
Vision |
Marking
Lead Pitch, Standoff |
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Performance |
MTBA |
>60 mins |
|
|
MTBF |
>168
hours |